Actividades de I+D

enIGFAE/USC

Pablo Vázquez (IGFAE-USC)

IV JORNADAS SOBRE LA PARTICIPACIÓN ESPAÑOLA EN FUTUROS ACELERADORES LINEALES

Madrid, 2-3 Diciembre 2009

P. Vázquez

R&D activities at Santiago

R&D in pixel detectors R&D in microstrip silicon detectors DEPFET project

Belle II PXD PS system Sensor characterization (Lab, testbeams) Gamma irradiation (Co-60)

FTD simulations

Dedicated personnel : 5 FTE Pablo Vázquez, Abraham Gallas, Daniel Esperante,

Jevgenij Visniakov, Carmen Iglesias, Eliseo Pérez, Javier Caride

2IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

R&D in pixel detectors

CERN + LHCb + Timepix/Medipix collaboration 2 test beams summer 2009 at CERN Telescope (6) + DUT made with Timepix 55 um pixel size 300 um thickness Hit resolution ~5 um Track resolution ~2.6 um

3IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

R&D in pixel detectors

Timepix/Medipix collaboration is working in adapting the Timepix ASIC for HEP experiments

Since we have obtained very good results in testbeamsa) The LHCb VELO upgrade group has decided to

choose the timepix as baseline pixel solutionb) LHCb + Timepix/Medipix has decided to build an

upgraded version of the Timepix telescope (funding partially requested to AIDA WP9)

4IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

R&D in pixel detectors

a) USC in collaboration with the CNM, Glasgow and CERN are building thinned pixel detectors 2D sensors thinned up to 200, 150 and 100 um To be readout with the Timepix and characterized as

function of the thickness Charge sharing Efficiency Time of arrival measurements

Sensors are being produced now Bump-bonding tryout also at CNM Possible design variations under discussion

Elongated pixels at 1st row, edgless, gard rings

5IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

R&D in pixel and microstrips silicon sensors

b) Telescope based on Timepix with following characteristics Active area: 2.8x2.8 cm2 Resolucion: 2 um, 1 ns Readout rate: 75 kHz

To be used in R&D in detectors for ILC or LHC upgrades with the contribution of the USC Timing Unit, integration of the DUT daq in the DAQ of the

telescope Mechanics of the DUT Cold box to work with irradiated sensors in the test beam

6IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

R&D in microstrip silicon detectors

In case the pixel option cannot meet the physics and time scale requirements, the silicon strip option should hold for LHCb VELO upgrade

The strip option should stay as close as possible to the current design improving its performance 40 MHz readout Higher granularity (x10 luminosity increase) Impact Parameter resolution Radiation hardness

USC wants to participate in the design and characterization of the new sensors, in the module assembly and tests with particle beams at CERN

Very useful for the FTD conception of ILC

IV jornadas FLC, Madrid, 2-3 Dec 2009 7

P. Vázquez

R&D in microstrip silicon detectors

1 module assembled in Santiago to be tested in the lab and in testbeam IT hybrid (3 beetles) + 2 pitch adapters + PR01

Hamamatsu sensor

IV jornadas FLC, Madrid, 2-3 Dec 2009 8

P. Vázquez

DEPFET: Belle II PXD PS system

9IV jornadas FLC, Madrid, 2-3 Dec 2009

50cm 2m

44 half-modules 17 voltages per

half-module Regulation cards

on radiation and B-field enviroment

22 x half-module

P. Vázquez

DEPFET: Belle II PXD PS system

10IV jornadas FLC, Madrid, 2-3 Dec 2009

Regul.DHH

PXD

PS

Regul.DHH

PS

Electronicshut

No radiation

~krad + H field

Belle layout

750 voltages

1500 lines

> 500W

P. Vázquez

DEPFET: sensor characterization

Lab test Gain (radioactive source), charge collection (laser) Dependence with radiation

11IV jornadas FLC, Madrid, 2-3 Dec 2009

241Am sourceon a

PXD5 matrix

P. Vázquez

DEPFET: sensor characterization

Testbeams TB09 data taking and analysis Future testbeams

Irradiated module Power supply prototype

12IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

DEPFET: 2009 test beam analysis

13IV jornadas FLC, Madrid, 2-3 Dec 2009

Eutelescopeframeworkinstalled, someprocesorsworking

P. Vázquez

Gamma irradiation

Failed depfet PXD5 module irradiation this summer Module dead before irradiation

PXD5 matrices being tested in Karlsruhe and Santiago Dec 09 up to 10Mrad

PXD6 matrices will be irradiated next year14IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

ASIC development

In collaboration with Grupo de Vision Artificial at USC a project was submitted to Xunta de Galicia to be produced byTezzaron, using TSVs, a 3D pixel readout chip demonstrator for HEP applications CMOS 3D 130nm technology 64x64 pixels of 40x40 um pixel size 4 layers

Sensor: pn diode Signal conditioning: amplification, test pulse,

comparator Signal processing: time stamping, counter, time over

threshold, 8bit memory Readout

Possible incorporation of 2 members of this group to the R&D for FLC project in 2013

15IV jornadas FLC, Madrid, 2-3 Dec 2009

P. Vázquez

ILC Forward Tracking Disks Simulations

16IV jornadas FLC, Madrid, 2-3 Dec 2009

Hit densities have been determined with the new geometry (ILD_00), magnetic field (3.5T) and software for each disk

Baseline 3 inner disks with pixel 4 outer disks with strips Density: nhit/cm2/BX (1BX=1event)

Muon1GeV Muon10 GeV Muon100 GeV Ttbar

FTD_1 2.03* 10-4 2.07 * 10-4 2.03 *10-4 1.09*10-2

FTD_2 1.33*10-4 1.38 * 10-4 1.35 * 10-4 6.34 *10-3

FTD_3 3.84*10-5 3.75 *10-5 3.78 *10-5 2.39 *10-3

FTD_4 2.92*10-5 2.70 * 10-5 2.67*10-5 2.32 *10-3

FTD_5 2.33 *10 -5 1.86 *10-5 1.89 *10-5 1.99 *10-3

FTD_6 2.11 *10-5 1.32 *10-5 1.37 *10-5 1.79 *10-3

FTD_7 1.85 *10-5 9.95 *10-6 1.05 *10-5 1.65 *10-3

P. Vázquez

ILC Forward Tracking Disks Simulations

Disk segmentation in petals has also been optimized with the constrain of the wafer size

Hit density more uniform than a simple 8 petal/disk segmentation

17IV jornadas FLC, Madrid, 2-3 Dec 2009

nhits/cm2/BX Areacm2

Muons1 GeV

Muons10 GeV

Muons100GeV

Ttbar->bbcssc

FTD_1 (8 pet) 99.6 1.90 *10-4 2.14 * 10-4 2.11 * 10-4 1.06 *10-2

FTD_2 ( 8 pet) 99.13 1.12 *10-4 1.35 *10 -4 1.36*10 -4 6.01 *10-3

FTD_3 (20pet) 165.93 3.01 * 10-5 2.94*10-5 3.56 *10-5 2.56 *10 -3

FTD_4 (16 pet) 167.72 2.35* 10-5 2.61 *10-5 2.67 *10-5 2.07 * 10-3

FTD_5 (16 pet) 154.13 2.23 * 10-5 1.65*10-5 1.65*10-5 1.98 * 10-3

FTD_6 (16 pet) 136.93 2.67* 10-5 1.69 *10-5 1.37 *10-5 1.81 *10-3

FTD_7 (16 pet) 116.19 2.02*10-5 1.42 *10-5 8.39 *10-6 1.67 * 10-3

According to the hit density disk 3 should probably have the same technology than the outer disks

P. Vázquez

Summary on R&D activities in the USC

R&D in pixel detectors R&D in microstrips silicon detectors DEPFET project

Belle II PXD PS system Sensor characterization (Lab, testbeams) Gamma irradiation (Co-60)

FTD simulations

18IV jornadas FLC, Madrid, 2-3 Dec 2009