Actividades de I+D
enIGFAE/USC
Pablo Vázquez (IGFAE-USC)
IV JORNADAS SOBRE LA PARTICIPACIÓN ESPAÑOLA EN FUTUROS ACELERADORES LINEALES
Madrid, 2-3 Diciembre 2009
P. Vázquez
R&D activities at Santiago
R&D in pixel detectors R&D in microstrip silicon detectors DEPFET project
Belle II PXD PS system Sensor characterization (Lab, testbeams) Gamma irradiation (Co-60)
FTD simulations
Dedicated personnel : 5 FTE Pablo Vázquez, Abraham Gallas, Daniel Esperante,
Jevgenij Visniakov, Carmen Iglesias, Eliseo Pérez, Javier Caride
2IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
R&D in pixel detectors
CERN + LHCb + Timepix/Medipix collaboration 2 test beams summer 2009 at CERN Telescope (6) + DUT made with Timepix 55 um pixel size 300 um thickness Hit resolution ~5 um Track resolution ~2.6 um
3IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
R&D in pixel detectors
Timepix/Medipix collaboration is working in adapting the Timepix ASIC for HEP experiments
Since we have obtained very good results in testbeamsa) The LHCb VELO upgrade group has decided to
choose the timepix as baseline pixel solutionb) LHCb + Timepix/Medipix has decided to build an
upgraded version of the Timepix telescope (funding partially requested to AIDA WP9)
4IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
R&D in pixel detectors
a) USC in collaboration with the CNM, Glasgow and CERN are building thinned pixel detectors 2D sensors thinned up to 200, 150 and 100 um To be readout with the Timepix and characterized as
function of the thickness Charge sharing Efficiency Time of arrival measurements
Sensors are being produced now Bump-bonding tryout also at CNM Possible design variations under discussion
Elongated pixels at 1st row, edgless, gard rings
5IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
R&D in pixel and microstrips silicon sensors
b) Telescope based on Timepix with following characteristics Active area: 2.8x2.8 cm2 Resolucion: 2 um, 1 ns Readout rate: 75 kHz
To be used in R&D in detectors for ILC or LHC upgrades with the contribution of the USC Timing Unit, integration of the DUT daq in the DAQ of the
telescope Mechanics of the DUT Cold box to work with irradiated sensors in the test beam
6IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
R&D in microstrip silicon detectors
In case the pixel option cannot meet the physics and time scale requirements, the silicon strip option should hold for LHCb VELO upgrade
The strip option should stay as close as possible to the current design improving its performance 40 MHz readout Higher granularity (x10 luminosity increase) Impact Parameter resolution Radiation hardness
USC wants to participate in the design and characterization of the new sensors, in the module assembly and tests with particle beams at CERN
Very useful for the FTD conception of ILC
IV jornadas FLC, Madrid, 2-3 Dec 2009 7
P. Vázquez
R&D in microstrip silicon detectors
1 module assembled in Santiago to be tested in the lab and in testbeam IT hybrid (3 beetles) + 2 pitch adapters + PR01
Hamamatsu sensor
IV jornadas FLC, Madrid, 2-3 Dec 2009 8
P. Vázquez
DEPFET: Belle II PXD PS system
9IV jornadas FLC, Madrid, 2-3 Dec 2009
50cm 2m
44 half-modules 17 voltages per
half-module Regulation cards
on radiation and B-field enviroment
22 x half-module
P. Vázquez
DEPFET: Belle II PXD PS system
10IV jornadas FLC, Madrid, 2-3 Dec 2009
Regul.DHH
PXD
PS
Regul.DHH
PS
Electronicshut
No radiation
~krad + H field
Belle layout
750 voltages
1500 lines
> 500W
P. Vázquez
DEPFET: sensor characterization
Lab test Gain (radioactive source), charge collection (laser) Dependence with radiation
11IV jornadas FLC, Madrid, 2-3 Dec 2009
241Am sourceon a
PXD5 matrix
P. Vázquez
DEPFET: sensor characterization
Testbeams TB09 data taking and analysis Future testbeams
Irradiated module Power supply prototype
12IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
DEPFET: 2009 test beam analysis
13IV jornadas FLC, Madrid, 2-3 Dec 2009
Eutelescopeframeworkinstalled, someprocesorsworking
P. Vázquez
Gamma irradiation
Failed depfet PXD5 module irradiation this summer Module dead before irradiation
PXD5 matrices being tested in Karlsruhe and Santiago Dec 09 up to 10Mrad
PXD6 matrices will be irradiated next year14IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
ASIC development
In collaboration with Grupo de Vision Artificial at USC a project was submitted to Xunta de Galicia to be produced byTezzaron, using TSVs, a 3D pixel readout chip demonstrator for HEP applications CMOS 3D 130nm technology 64x64 pixels of 40x40 um pixel size 4 layers
Sensor: pn diode Signal conditioning: amplification, test pulse,
comparator Signal processing: time stamping, counter, time over
threshold, 8bit memory Readout
Possible incorporation of 2 members of this group to the R&D for FLC project in 2013
15IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
ILC Forward Tracking Disks Simulations
16IV jornadas FLC, Madrid, 2-3 Dec 2009
Hit densities have been determined with the new geometry (ILD_00), magnetic field (3.5T) and software for each disk
Baseline 3 inner disks with pixel 4 outer disks with strips Density: nhit/cm2/BX (1BX=1event)
Muon1GeV Muon10 GeV Muon100 GeV Ttbar
FTD_1 2.03* 10-4 2.07 * 10-4 2.03 *10-4 1.09*10-2
FTD_2 1.33*10-4 1.38 * 10-4 1.35 * 10-4 6.34 *10-3
FTD_3 3.84*10-5 3.75 *10-5 3.78 *10-5 2.39 *10-3
FTD_4 2.92*10-5 2.70 * 10-5 2.67*10-5 2.32 *10-3
FTD_5 2.33 *10 -5 1.86 *10-5 1.89 *10-5 1.99 *10-3
FTD_6 2.11 *10-5 1.32 *10-5 1.37 *10-5 1.79 *10-3
FTD_7 1.85 *10-5 9.95 *10-6 1.05 *10-5 1.65 *10-3
P. Vázquez
ILC Forward Tracking Disks Simulations
Disk segmentation in petals has also been optimized with the constrain of the wafer size
Hit density more uniform than a simple 8 petal/disk segmentation
17IV jornadas FLC, Madrid, 2-3 Dec 2009
nhits/cm2/BX Areacm2
Muons1 GeV
Muons10 GeV
Muons100GeV
Ttbar->bbcssc
FTD_1 (8 pet) 99.6 1.90 *10-4 2.14 * 10-4 2.11 * 10-4 1.06 *10-2
FTD_2 ( 8 pet) 99.13 1.12 *10-4 1.35 *10 -4 1.36*10 -4 6.01 *10-3
FTD_3 (20pet) 165.93 3.01 * 10-5 2.94*10-5 3.56 *10-5 2.56 *10 -3
FTD_4 (16 pet) 167.72 2.35* 10-5 2.61 *10-5 2.67 *10-5 2.07 * 10-3
FTD_5 (16 pet) 154.13 2.23 * 10-5 1.65*10-5 1.65*10-5 1.98 * 10-3
FTD_6 (16 pet) 136.93 2.67* 10-5 1.69 *10-5 1.37 *10-5 1.81 *10-3
FTD_7 (16 pet) 116.19 2.02*10-5 1.42 *10-5 8.39 *10-6 1.67 * 10-3
According to the hit density disk 3 should probably have the same technology than the outer disks
P. Vázquez
Summary on R&D activities in the USC
R&D in pixel detectors R&D in microstrips silicon detectors DEPFET project
Belle II PXD PS system Sensor characterization (Lab, testbeams) Gamma irradiation (Co-60)
FTD simulations
18IV jornadas FLC, Madrid, 2-3 Dec 2009
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